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Thermal grease | Heat sink compound
Thermal grease | Heat sink compound
Thermal grease | Heat sink compound (In Stock)
Rs.750 33.33%
Rs.500 (Pack of 1 )
Tax: 18.00%
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USE: Apply to all mounting and threaded surfaces of the device and chassis. CONTAINS: Zinc oxide and polydimethyl siloxane. Transfer heat away from; Heat Sinks, Transistors, Power Diodes, Semi-Conductors Ballast’s & Thermocouple Wells.
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Product Specification Description
Product Specification for "Thermal grease | Heat sink compound"
  1. Thermal Conductivity: 0.67 Watts per meter K
  2. Specific Gravity: 2.1 @25OC
  3. Silicone and Zinc Oxides
  4. Viscosity: 542000 mPa.s
  5. Shelf Life: 60 months
Product Description for "Thermal grease | Heat sink compound"

Transfer Heat Away from Electronic Components and Parts

Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).